2026.02.24 NYCU and MUFG Sign MOU: Strategic Partnership for Semiconductor Talent and Industry-Academia Co-Creation National Yang Ming Chiao Tung University (NYCU), in collaboration with MUFG Bank, co-hosted the “MUFG x NYCU Semiconductor Conference.” Bringing together over 450 industry, government, and academic leaders from across the APAC region both in-person and online, the conference highlighted…
Read More2026.01.30 Japan-Taiwan Disaster Prevention Cooperation Forum in Kaohsiung: Building a Global Model for Disaster Resilience Together On January 30, 2026, the Taiwan-Japan Exchange Office (TJEO), in collaboration with the Japan-Taiwan Exchange Association, co-hosted the “Japan-Taiwan Disaster Prevention Cooperation Forum in Kaohsiung, Taiwan 2026” at the Kaohsiung Campus of National Yang Ming Chiao Tung University. Bringing…
Read More2026.01.14 NYCU Advances Taiwan–Japan Semiconductor Co-Creation at SEMICON Japan and Strategic Investment Forums Coinciding with SEMICON Japan, NYCU dispatched a delegation to Tokyo to unveil a new strategic framework for Taiwan-Japan semiconductor collaboration. Based on the concept that today’s competitiveness hinges on ecosystems rather than standalone technologies, this article details the shift from…
Read More2025.05.07 NYCU Participated in the Inaugural Ceremony of the Taiwan-Japan Semiconductor and Technology Association NYCU President LIN Chi-Hung, Professor SAMUKAWA Seiji, Director of TJEO, and Deputy Director Dr. Austin Chen, attended the inaugural ceremony of “Taiwan-Japan Semiconductor and Technology Association” held at the Taipei International Convention Center (TICC) on May 7, 2025. The…
Read More2024.12.11 NYCU, Hokkaido University, Tohoku University and Kyushu University cohosted 1st Taiwan-Japan Global Partnership Semiconductor and Innovation Startup Forum On December 11th, NYCU, Hokkaido University, Tohoku University and Kyushu University cohosted the first international forum at NYCU. The forum was held to deepen collaboration between Taiwan and Japan. This first edition focused on TSMC’s expansion…
Read More